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Thursday, June 27 • 10:00am - 10:50am
DI6: System-in-Package Solutions Size Wars: The Package Strikes Back

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Improvements in silicon process technology, driven by Moore's Law, have enabled the age of IoT/IIoT. However, as new applications push the boundaries of form, fit, and function, packaging technology must drive innovation. System-in-Package (SiP) enables new levels of integration, combining processors, memory, power, RF, sensors, and passives into single, tiny, easy to layout packages. SiP provides the optimal system solution for your application by integrating the best components from various vendors in the smallest footprint.

Speakers
avatar for Gene Frantz

Gene Frantz

Co-Founder & CTO, Octavo Systems
Gene is one of the founders and the visionary behind Octavo Systems. He currently serves as Chief Technology Officer. He is also a Professor in the Practice at Rice University in the Electrical and Computer Engineering Department. Previously, Gene was the Principal Technology Fellow... Read More →


Thursday June 27, 2019 10:00am - 10:50am
Room 230B