Improvements in silicon process technology, driven by Moore's Law, have enabled the age of IoT/IIoT. However, as new applications push the boundaries of form, fit, and function, packaging technology must drive innovation. System-in-Package (SiP) enables new levels of integration, combining processors, memory, power, RF, sensors, and passives into single, tiny, easy to layout packages. SiP provides the optimal system solution for your application by integrating the best components from various vendors in the smallest footprint.